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19-2015; Rev 2; 8/02
KIT ATION EVALU ABLE AVAIL
RF Power Detectors in UCSP
General Description Features
o Space-Saving 2
2
MAX2205-MAX2208
The MAX2205-MAX2208 wideband (800MHz to 2GHz) power detectors are ideal for GSM/EDGE (MAX2206), TDMA (MAX2207), and CDMA (MAX2205/MAX2208) applications. The MAX2206/MAX2207/MAX2208 take an RF signal from a directional coupler at the input, and output a highly repeatable voltage. The output voltage increases monotonically with increasing input power. The output is compensated for temperature and process shifts, reducing the worst-case variation to less than 1dB at full power and 2.5dB at the lowest power. The MAX2206 features 40dB dynamic range, making it ideally suited to GSM/EDGE applications. The MAX2207 offers reduced current consumption for TDMA applications. The MAX2205/MAX2208 each have an integrated filter to allow for average power detection of CDMA signals over a 25dB dynamic range. The MAX2206/MAX2207/MAX2208 offer internal 50 termination for interfacing with a directional coupler. The MAX2205 has a high-impedance input to provide a lowloss resistive tap in CDMA applications. All devices allow the user to control the averaging time constant externally. The MAX2205-MAX2208 come in a space-saving 2 2, 0.5mm-pitch UCSPTM and require only three external components.
UCSP Occupies Only 1mm2
o Internal Temperature Compensation Gives 0.3dB Detection Accuracy o No External Filter or Op Amp Required o Power-Detection Range 40dB (MAX2206) 25dB (MAX2205/MAX2207/2208)
Ordering Information
PART MAX2205EBS MAX2206EBS MAX2207EBS MAX2208EBS TEMP RANGE -40C to +85C -40C to +85C -40C to +85C -40C to +85C BUMP-PACKAGE 2 x 2 UCSP* 2 x 2 UCSP* 2 x 2 UCSP* 2 x 2 UCSP*
*Requires solder temperature profile described in the Absolute Maximum Ratings section.
2 2 UCSP 1.01 mm 1.01 mm
UCSP is a trademark of Maxim Integrated Products, Inc.
Applications
Dual-Band GSM/EDGE Handsets Dual-Band CDMA/TDMA Handsets WCDMA Handsets PA Modules
Pin Configuration/Functional Diagram/Typical Operating Circuit
TOP VIEW
SHDN LOGIC INPUT 10k (MAX2205) 240 (MAX2206/MAX2207/MAX2208) 680 (MAX2205) 10 (MAX2206) 0 (MAX2207/MAX2208) RFIN/SHDN (A1) TEMPERATURECOMPENSATED PEAK DETECTOR VCC (A2) VCC
FROM PA OUTPUT (MAX2205)
FROM COUPLER/TAP (MAX2206/MAX2207/MAX2208)
47pF
27pF
SHUTDOWN LOGIC
MAX2205 MAX2206 MAX2207 MAX2208
OUT (B2)
GND (B1)
TO ADC CFILTER (OPTIONAL)
UCSP
________________________________________________________________ Maxim Integrated Products
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RF Power Detectors in UCSP MAX2205-MAX2208
ABSOLUTE MAXIMUM RATINGS
VCC to GND ...........................................................-0.3V to +6.5V RFIN/SHDN to GND....................................-0.3V to (VCC + 0.3V) RF Input Power (800MHz) (MAX2206/MAX2207/MAX2208) .................................+20dBm RF Input Power (2GHz) (MAX2206/MAX2207/MAX2208) .................................+17dBm RF Input Voltage (800MHz) (MAX2205) ..............................1.5VP RF Input Voltage (2GHz) (MAX2205) ..................................0.8VP Continuous Power Dissipation (TA = +70C) 2 2 UCSP (derate 3.8mW/C above +70C) ............303mW Operating Temperature Range ...........................-40C to +85C Junction Temperature ......................................................+150C Storage Temperature Range .............................-65C to +160C Bump Temperature (soldering) (Note 1) Infrared (15s) ..............................................................+220C Vapor Phase (60s) ......................................................+215C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS (MAX2205-MAX2208)
(VCC = +2.7V to +5.0V, SHDN = +2.0V, no RF signal applied, TA = -40C to +85C. Typical values are at VCC = +2.85V and TA = +25C, unless otherwise noted.) (Note 2)
PARAMETER Supply Voltage Idle Supply Current Shutdown Supply Current OUT Voltage During Shutdown Logic-High Threshold Logic-Low Threshold SHDN Input Current Output Current Source Capability Output Current Sink Capability SYMBOL VCC IIDLE I SHDN VOUT VH VL IIH IIL SHDN = +2.0V SHDN = +0.6V MAX2206/MAX2207, VOUT = +2.5V MAX2206/MAX2207, VOUT = 0V -1 -1 400 300 MAX2206 MAX2205/MAX2207/MAX2208 SHDN = 0V SHDN = 0V 2.0 0.6 +10 +1 CONDITIONS MIN 2.7 3.5 2 0.5 TYP MAX 5.0 5.5 3.5 10 0.01 UNITS V mA A V V V A A A
AC ELECTRICAL CHARACTERISTICS (MAX2205)
(MAX2205 EV kit, VCC = +2.7V to +5.0V, SHDN = +2.0V, fRF = 800MHz to 2GHz, 50 system, TA = -40C to +85C. Typical values are at VCC = +2.85V and TA = +25C, unless otherwise noted.) (Note 2)
PARAMETER RF Input Frequency Turn-On Time Response Time SYMBOL fRF tON tR (Note 3) VCC = +2.85V, TA = -40C to +85C High input power (Note 4) Low input power (Note 5) CONDITIONS MIN 800 2 15 0.3 1.3 1 dB 2.5 TYP MAX 2000 UNITS MHz s s
Variation Due to Temperature
2
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RF Power Detectors in UCSP
AC ELECTRICAL CHARACTERISTICS (MAX2206/MAX2207/MAX2208)
(MAX2206/MAX2207/MAX2208 EV kit, VCC = +2.7V to +5.0V, SHDN = 2.0V, fRF = 800MHz to 2GHz, 50 system, TA = -40C to +85C. Typical values are at VCC = +2.85V and TA = +25C, unless otherwise noted.) (Note 2)
PARAMETER RF Input Frequency RF Input VSWR Turn-On Time Response Time (Note 3) Variation Due to Temperature SYMBOL fRF VSWR tON tR MAX2206/MAX2207 MAX2208 High input power (Note 6) VCC = +2.85V, TA = -40C to +85C Low input power (Note 7) CONDITIONS MIN 800 2:1 2 300 15 0.3 1.3 1 2.5 s ns s dB TYP MAX 2000 UNITS MHz
MAX2205-MAX2208
Note 1: This device is constructed using a unique set of packaging techniques that imposes a limit on the thermal profile the device can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Preheating is required. Hand or wave soldering is not allowed. Note 2: Specifications over TA = -40C to +85C are guaranteed by design. Production tests are performed at TA = +25C. Note 3: Response time is taken from the time the RF signal is applied to 90% of the final value of VOUT. Note 4: At 800MHz, output voltage is held at a value that nominally results from the final value of +31dBm input power. Deviation from +31dBm is specified. At 2GHz, output voltage is held at a value that nominally results from +28dBm input power. Deviation from +28dBm is specified. Note 5: At 2GHz, output voltage is held 22dB lower than specified in Note 4. At 800MHz, output voltage is held 25dB lower than specified in Note 4. Note 6: At 800MHz, output voltage is held at a value that nominally results from +15dBm input power. Deviation from +15dBm is specified. At 2GHz, output voltage is held at a value that nominally results from +13dBm input power. Deviation from +13dBm is specified. Note 7: For MAX2206, output voltage is held 40dB lower than specified in Note 7; for MAX2207/MAX2208, output voltage is held 25dB lower than specified in Note 7.
Typical Operating Characteristics
(MAX2206/MAX2207/MAX2208 EV kit, TA = +25C, unless otherwise noted.)
MAX2206 OUTPUT VOLTAGE vs. INPUT POWER
MAX2205/06/07/08 toc01
MAX2206 OUTPUT VOLTAGE vs. INPUT POWER
MAX2205/06/07/08 toc02
MAX2206 RESPONSE TIME vs. TEMPERATURE
315 310 RESPONSE TIME (ns) 305 300 295 290 285 280 275 VCC = +2.7V fRF = 900MHz PIN = +15dBm
MAX2205/06/07/08 toc03
2.0 1.8 1.6 OUTPUT VOLTAGE (V) 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 -25 -20 -15 -10 -5 0 POWER (dBm) VCC = +2.7V TA = -40C 5 10 VCC = +3.5V TA = +85C VCC = +2.7V to +3.5V fRF = 800MHz TA = -40C TO +85C
1.6 1.4 OUTPUT VOLTAGE (V) 1.2 1.0 0.8 0.6 0.4 0.2 0 VCC = +3.5V TA = +85C VCC = +2.7V TA = -40C -25 -20 -15 -10 -5 0 5 10 VCC = +2.7V to +3.5V fRF = 2GHz TA = -40C TO +85C
320
270 265 -40
VCC = +3.5V -15 10
VCC = +3.0V 35 60 85
15
15
POWER (dBm)
TEMPERATURE (C)
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RF Power Detectors in UCSP MAX2205-MAX2208
Typical Operating Characteristics (continued)
(MAX2206/MAX2207/MAX2208 EV kit, TA = +25C, unless otherwise noted.)
MAX2207/MAX2208 OUTPUT VOLTAGE vs. INPUT POWER
MAX2205/06/07/08 toc04
MAX2207/MAX2208 OUTPUT VOLTAGE vs. INPUT POWER
MAX2205/06/07/08 toc05
MAX2207 RESPONSE TIME vs. TEMPERATURE
fRF = 900MHz PIN = +15dBm VCC = +2.7V
MAX2205/06/07/08 toc06
2.5 VCC = +2.7V to +3.5V fRF = 800MHz TA = -40C TO +85C
1.8 1.6 1.4 OUTPUT VOLTAGE (V) 1.2 1.0 0.8 0.6 0.4 VCC = +3.5V TA = +85C VCC = +2.7V TA = -40C -10 -5 0 5 10 VCC = +2.7V to +3.5V fRF = 2GHz TA = -40C TO +85C
310 305 RESPONSE TIME (ns) 300 295 290 VCC = +3.0V 285 280 275 VCC = +3.5V
2.0 OUTPUT VOLTAGE (V)
1.5
1.0 VCC = +3.5V TA = +85C VCC = +2.7V TA = -40C 0 -10 -5 0 5 10 15 POWER (dBm)
0.5
0.2 0 POWER (dBm)
15
-40
-15
10
35
60
85
TEMPERATURE (C)
MAX2205/MAX2208 RESPONSE TIME vs. TEMPERATURE
MAX2205/06/07/08 toc07
MAX2205 OUTPUT VOLTAGE vs. INPUT POWER
MAX2205/06/07/08 toc08
MAX2205 OUTPUT VOLTAGE vs. INPUT POWER
0.7 0.6 OUTPUT VOLTAGE (V) 0.5 0.4 0.3 0.2 VCC = +3.5V TA = +85C VCC = +2.7V to +3.5V fRF = 1880MHz TA = -40C to +85C MAX2205 EV KIT
MAX2205/06/07/08 toc09
19 18 17 RESPONSE TIME (s) 16 15 14 13 12 11 10 -40 -15 10 35 60 VCC = +3.0V VCC = +3.5V fRF = 900MHz PIN = +15dBm (MAX2208) PIN = +31dBm (MAX2205) VCC = +2.7V
2.5
0.8
2.0 OUTPUT VOLTAGE (V)
VCC = +2.7V to +3.5V fRF = 836MHz TA = -40C to +85C MAX2205 EV KIT
1.5 VCC = +3.5V TA = +85C
1.0
0.5 VCC = +2.7V TA = -40C 0 85 6 11 16 21 26 31 TEMPERATURE (C) INPUT POWER (dBm)
0.1 0 6 10 14 18
VCC = +2.7V TA = -40C 22 26
INPUT POWER (dBm)
Pin Description
PIN A1 A2 B1 B2 NAME RFIN/SHDN VCC GND OUT FUNCTION RF Input and Shutdown Logic Input. AC-couple the RF input to this pin and apply the shutdown logic input through a resistor. Drive low to turn the part off, drive high, or connect to VCC to turn the part on. Power-Supply Pin. Bypass to GND with a capacitor as close to the bump as possible. Ground Connection. Multiple ground vias placed as close to the IC as possible should be used to connect the ground pin to the ground plane. Connect to PC board ground plane with as low inductance as possible. Detector Output
4
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RF Power Detectors in UCSP
Applications Information
The MAX2205-MAX2208 have internal termination resistors for use with directional couplers. The application circuit is shown in Figure 1. The output of the detector goes to an op amp in an analog GSM powercontrol scheme, or to an ADC in other systems such as TDMA or discrete-time GSM power control. The MAX2205 has high-input impedance for use with high-value resistive tapping from a CDMA power amplifier. This coupling method is the lowest cost and lowest loss when used with an isolator. The application circuit is shown in Figure 2. Connect C FILTER from the MAX2205 output to GND to reduce residual amplitude ripple. For IS98A reverse channel signal with peak-toavg ratio of 3.9dB, a 1.5nF capacitor gives 43mVP-P ripple at 28dBm PA output and 390s response time. For CDMA2000 (pilot + DCCH) with peak-to-avg ratio of 5.4dB, the ripple is about 65mVP-P at 26dBm PA output. The MAX2205 input impedance is listed in Table 1.
UCSP Reliability
The UCSP is a unique package that greatly reduces board space compared to other packages. UCSP reliability is integrally linked to the user's assembly methods, circuit board material, and usage environment. The user should closely review these areas when considering using a UCSP. This form factor might not perform equally to a packaged product through traditional mechanical reliability tests. Performance through operating life test and moisture resistance remains uncompromised, as it is determined primarily by the wafer-fabrication process. Mechanical stress performance is a greater consideration for a UCSP. UCSP solder-joint contact integrity must be considered because the package is attached through direct solder contact to the user's PC board. Testing done to characterize the UCSP reliability performance shows that it is capable of performing reliably through environmental stresses. Results of environmental stress tests and additional usage data and recommendations are detailed in the UCSP application note, which can be found on Maxim's website, www.maxim-ic.com.
MAX2205-MAX2208
Layout
As with any RF circuit, the layout of the MAX2205- MAX2208 circuits affects performance. Use a short 50 line at the input with multiple ground vias along the length of the line. The input capacitor and resistor should be placed as close to the IC as possible. The VCC input should be bypassed as close as possible to the IC with multiple vias connecting the capacitor to ground. Refer to the MAX2205-MAX2208 EV kit data sheet for a sample layout and details.
Chip Information
TRANSISTOR COUNT: 344
PA
COUPLER TO ANT
50
PA
ISOLATOR/ CIRCULATOR
TO ANT 680
TO ADC OR OP AMP MAX2206 MAX2207 MAX2208 PEAK DETECTOR
47pF TO ADC MAX2205 PEAK DETECTOR CFILTER
Figure 1. MAX2206/MAX2207/MAX2208 Typical Application Circuit
Figure 2. MAX2205 Typical Application Circuit
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RF Power Detectors in UCSP MAX2205-MAX2208
Table 1. MAX2205 Input Impedance (R || jX, PC Board De-Embedded)
FREQUENCY (GHz) 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 PIN = -30dBm REAL 189.9 177.3 165.8 155.2 146.4 138.8 131.5 123.3 115.0 107.2 110.7 105.3 94.7 IMAG -51.7 -47.4 -43.6 -40.3 -37.6 -35.0 -32.9 -30.7 -29.1 -27.5 -26.7 -25.2 -23.6 REAL 199.4 185.5 175.2 167.0 158.8 150.9 144.0 139.4 131.6 132.0 126.6 120.3 111.4 PIN = +5dBm IMAG -54.0 -49.4 -45.7 -42.5 -39.8 -37.3 -35.1 -33.3 -31.8 -30.9 -29.3 -27.9 -26.7
Table 2. MAX2205-MAX2208 Device Marking Codes
DEVICE MAX2205EBS MAX2206EBS MAX2207EBS MAX2208EBS CODE AFR AFO AFP AFQ
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RF Power Detectors in UCSP
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.)
4L, UCSP 2x2.EPS
MAX2205-MAX2208
PACKAGE OUTLINE, 2x2 UCSP 21-0117 G
1 1
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
7 _____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 (c) 2002 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.

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